乐泰 MULTICORE HF 250DP乐泰胶水,电子胶水
技术服务热线:021-51693135 / 021-22818476
产品描述
乐泰 HF 250DP提供以下产品特性:
技术焊膏
应用无铅焊接
乐泰 HF 250DP焊膏是无卤素,不干净,低排泄无铅焊膏。 这是一种低金属含量配制用于分配应用的焊膏。
特点和好处:
优化使用27号针实现一致的250至300μm点直径
适用于氮气回流
典型属性:
焊膏典型属性
合金96SC(SAC387)
粉末粒度,μm15〜25
粉末尺寸编码KBP
IPC等效类型5
金属装载(重量%)84
布鲁克菲尔德粘度,mPa∙s(cP)@ 25°C:160,000
Malcom粘度速度10rpm,@ 25℃,
mPa∙s(cP):29,000
马尔科姆触变指数,mPa·s(cP)0.6
存储:乐泰 HF 250DP应保存6个月@≤-18°C。
PRODUCT DESCRIPTION
乐泰 HF 250DP provides the following product characteristics:
Technology Solder paste
Application Pb-free soldering
乐泰 HF 250DP solder paste is a halogen-free, no clean, low voiding Pb-free solder paste. It is a low metal content
solder paste formulated for dispense applications.
FEATURES AND BENEFITS:
Optimized to achieve consistent 250 to 300 μm dot diameter using a 27 gauge needle
Suitable for reflow in nitrogen
TYPICAL PROPERTIES:
Solder Paste Typical Properties
Alloys 96SC (SAC387)
Powder Particle Size, μm 15 to 25
Powder Size Coding KBP
IPC Equivalent Type 5
Metal Loading (Weight %) 84
Brookfield Viscosity, mPa∙s (cP)@ 25°C:160,000
Malcom Viscosity Speed 10 rpm, @ 25°C,
mPa∙s (cP):29,000
Malcolm Thixotropic Index, mPa∙s (cP) 0.6
Storage: 乐泰 HF 250DP should be stored 6 months @ ≤-18°C |