Gap Filler 1100 SF 乐泰胶水,电子胶水
技术服务热线:021-51693135 / 021-22818476
间隙填料1100SF是用于硅树脂敏感应用的热解决方案。该材料作为两部分组件提供,在室温或高温下固化。材料表现出低模量性能,然后固化成柔软的弹性体,有助于减少热循环操作过程中的应力以及在低应力应用的装配过程中实际消除应力。这两种组分是有色的,可用作混合指示剂(体积比为1:1)。混合系统将在环境温度下固化。不像固化的热垫材料,液体方法提供了无限的厚度变化,在组装位移过程中几乎没有或没有应力。间隙填料1100SF尽管具有一些天然的粘合特性,但不适用于需要机械结构粘合的热界面应用。
Gap Filler 1100SF is the thermal solution for silicone-sensitive applications.The material is supplied as a two-part component, curing at room or elevated temperatures.The material exhibits low modulus properties then cures to a soft, flexible elastomer, helping reduce thermal cycling stresses during operation and virtually eliminating stress during assembly of low-stress applications. The two components are colored to assist as a mix indicator (1:1 by volume).The mixed system will cure at ambient temperature.Unlike cured thermal pad materials, the liquid approach offers infinite thickness variations with little or no stress during assembly displacement. Gap Filler 1100SF, although exhibiting some natural tack characteristics, is not intended for use in thermal interface applications requiring a mechanical structural bond.
CURE SCHEDUL |