Gap Filler 1500LV乐泰胶水,电子胶水
技术服务热线:021-51693135 / 021-22818476
导热,液体间隙填料材料间隙填料1500LV是一种两部分,高性能,导热,液体间隙填充材料。这种材料提供了硅树脂材料的耐高温性和低模量,而硅氧烷除气的含量明显低于有机硅敏感应用。混合材料将在室温下固化,并可加热加热。固化后,间隙填料1500LV提供柔软的导热弹性体,适用于脆弱的组件或填充独特且复杂的空气空隙和间隙。液体分配的热材料提供无限厚度变化,并赋予敏感的极少压力组件组装。间隙填料1500LV具有低水平的自然粘着特性,适用于不需要强结构粘结的应用场合。
特点:导热系数:1.8W / m-K.对于有机硅敏感应用,低挥发性。具有良好的湿润性,完全不含固体,无固化副产物。优良的低温高温化学和机械稳定性
Thermally Conductive, Liquid Gap Filler Material Gap Filler 1500LV is a two-part, high performance, thermally conductive, liquid gap filling material. This material offers the high temperature resistance and low modulus of a silicone material with significantly lower levels of silicone outgassing for use in silicone sensitive applications. The mixed material will cure at room temperature and can be accelerated with the addition of heat. As cured, Gap Filler 1500LV provides a soft, thermally conductive, form-inplace elastomer that is ideal for fragile assemblies or for filling unique and intricate air voids and gaps.Liquid dispensed thermal materials offer infinite thickness variations and impart little to no stress on sensitive components during assembly. Gap Filler 1500LV exhibits low level natural tack characteristics and is intended for use in applications where a strong structural bond is not required.
Features:Thermal Conductivity: 1.8 W/m-K.Low volatility for silicone sensitive applications.Ultra-conforming, with excellent wet-out.100% solids — no cure by-products. Excellent low and high temperature chemical and mechanical stabilit |