Gap Pad 2200SF乐泰胶水,电子胶水
技术服务热线:021-51693135 / 021-22818476
产品描述导热,无硅无缝填充材料GapPad®2200SF是一种导热,电绝缘,无硅酮聚合物,专为有机硅敏感应用而设计。该材料非常适用于不均匀拓扑和高堆叠公差的应用。 GapPad®2200SF加固,便于材料处理,并在组装过程中增加了耐久性。该材料两侧都有保护衬垫。 GapPad®2200SF在一侧提供减少的粘性,允许老化过程和简单的返工。
特点:导热系数:2.0 W / m-K。无硅酮配方。中药符合易操作。电隔离
PRODUCT DESCRIPTION Thermally Conductive, Silicone-Free Gap Filling Material Gap Pad® 2200SF is a thermally conductive, electrically isolating,silicone-free polymer specially designed for silicone-sensitive applications.The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad® 2200SF is reinforced for easy material handling and added durability during assembly.The material is available with a protective liner on both sides. Gap Pad® 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework.
FEATURES :Thermal conductivity: 2.0 W/m-K.Silicone-free formulation.Medium compliance with easy handling.Electrically isolatin |