Gap Pad 2202SF乐泰胶水,电子胶水
技术服务热线:021-51693135 / 021-22818476
产品描述无硅配方,高性能导热材料GapPad®2202SF是一种高性能,2.0 W / m-K导热间隙填充材料。 GapPad®2202SF化合物通过设计无硅酮,对相邻表面提供极低的界面电阻.GapPad®2202SF专为有机硅敏感应用而设计。 该材料的结构在一侧具有0.5密耳的PET膜,另一面具有天然粘合。 天然粘合剂消除了对附加粘合剂层的需要。
特点:导热系数:2.0 W / m-K无硅酮配方。最小压缩套0.5毫米薄膜可提供无粘性表面。侧面易于处理和放置
安全存放的条件,存放在封闭的原装容器中,在干燥处。 远离不兼容的材料。 包括任何不兼容性
PRODUCT DESCRIPTION Silicone-Free Formulation, High Performance Thermally Conductive Material Gap Pad® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The Gap Pad® 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces.Gap Pad® 2202SF is specifically designed for silicone-sensitive applications. The material’s construction features a 0.5 mil PET film on one side and natural tack on the other. The natural tack eliminates the need for an additional adhesive layer.
FEATURES:Thermal conductivity: 2.0 W/m-K.Silicone-free formulation.Minimal compression set.0.5 mil film provides tack-free surface.Tacky side allows for ease of handling and placement
Conditions for safe storage, Store in closed original container in a dry place. Store away from incompatible materials. including any incompatibilitie |